Powerful cooling capacity in less than four racks
Single Phase Immersion Cooling
LiquidStack advanced flow technology optimizes heat transfer and rejection by directing fluid into the chassis to cool servers equipped with the latest high TDP chips. Its improved energy efficiency and additional fluid distribution throughout the unit enhance cooling effectiveness.
1Cooling Capacity
A cooling capacity of up to 110kW, supports chip Thermal Design Power (TDP) up to 1,000W. With up to 2.8kW per unit, it caters to high-performance cooling needs.
2Advanced Flow Technology
“Direct injection” and “infinity pool” fluid distribution enhance heat transfer efficiency. This innovative approach ensures optimal cooling by maximizing contact with heat-generating components.
3Optimized Dimensions
Tailored for data center retrofits and modular containers by matching the width of four standard IT racks (4 x 600mm rack spaces), the unit can also be positioned sideways in a standard ISO container. Moreover, its front-service access eliminates the need for side or rear maintenance space.
4Flexible Connection Points
Accommodates top or bottom piping and electrical connections to offer installation flexibility, particularly beneficial for retrofitting. This adaptability allows for seamless integration into various site configurations.
5Qualified Fluids
The system supports a range of tested and qualified fluids from various suppliers, enabling users to select the fluid that best meets their material compatibility, performance, and safety requirements. This ensures that users can tailor the cooling solution to their needs.
Immediate ROI
LiquidStack single phase immersion solutions reduce energy use on day one.
Space Savings
Our single phase immersion solutions provide more than 55% white space savings over air-cooled systems.
Energy Savings
Our single phase immersion solutions are more energy-efficient compared to traditional air cooling methods, delivering 80% energy savings (PUE)
Up to
110kW
Cooling capacity
Up to
800~1.000kW
Designed for chip with high TDPs
The highest cooling capacity solutions on the market
Thermal design power (TDP)
Supports chips rated up to 1,000W and minimizes power consumption.
Advanced flow technology
Optimizes heat transfer and rejection, as low as 1.03 pPUE, by leveraging warmer water temperatures.
Optimized system dimensions
Ensures data center retrofit and modular containers that fit between 4 x 600mm rack spaces and sideways in a standard ISO container.
Maximum cooling flow and
heat transfer
Directs fluid into server chassis to cool servers equipped with the latest high TDP chips.
Enhanced cooling effectiveness
Delivers improved energy efficiency and additional fluid distribution throughout the unit.
Single phase immersion solutions
The highest single phase cooling capacity on the market, supporting chip TDPs up to 1,000W. Inquire about our solutions.
Typical applications and use cases include
Regional edge, retrofitting existing data center infrastructure, artificial intelligence (AI), OTT, advanced cloud services, video and graphics rendering, high performance computing (HPC), and other low latency, high processing applications in the following sectors:
- Colocation
- Telecommunication
- Enterprise (industrial, oil and gas)
- High Performance Compute (HPC)
- Cryptomining
- Government and military
Explore our resources
Trusted by the Biggest Names in Data Center Technology
LiquidStack provides next-generation cooling solutions to many of the world’s largest cloud services, semiconductor, manufacturing and IT hardware providers, and has won numerous awards for data center innovation and sustainability.
Connect with our team to explore the optimal liquid cooling options for your organization
From maximum power density performance to meeting new environmental and regulatory standards, LiquidStack can help you adopt the technology or technologies that make most sense for you.
