High Performance Computing (HPC) Solutions
Best-in-class liquid cooling for the most demanding compute environments
Advanced Cooling
Solutions for High
Performance Computing
(HPC)
The specialized chips and dense architectures at the heart of HPC have reached the limits of existing cooling technologies.
Liquid cooling provides extreme performance for extreme computing. Over 90% of new HPC data centers are liquid-cooled today.
Use cases:
- High flux chip research and development
- OEM proof of concept, fluid testing, and qualification
- AI, ML, facial recognition, cyber security
- Virtualization and IT consolidation
- Research, labs, and computational modeling
LiquidStack’s Liquid Cooling Solutions
CDU
Direct-to-chip liquid cooling solutions
Up to 800kW and 1.2MW models available
MicroModular™
Provides up to 250kW of liquid cooling in a small modular container.
MacroModular™
Fits 6 x DataTank™ 48U systems
Provides up to 1.5MW of liquid cooling in a full modular container.
DataTank™ 4U
Rack Units: 4U
Two phase immersion cooling for edge and micro data centers.
DataTank™ 48U
Rack Units: 48U
Two phase immersion cooling tanks for full-scale data center deployments.
Cooling Capacity for Unmatched Server Density
Liquid cooling removes thermal bottlenecks at the device and facility level.
Air Cooling
Direct-to-Chip (Water)
Direct-to-Chip (Refrigerant)
1-Phase Immersion Cooling (Oil)
2-Phase Immersion Cooling
Density per rack (kW)
High performance compute designed to support dedicated, high performance processes
Highest compute density on the market
Designed for continuous 24/7 peak operation
Adaptable to virtual IT
Scalable for rightsized deployment
Reduces overall IT load by removing fans
Flexible fluid and communication options to support any operating conditions
Accommodates AC or OCPv4 power distribution
LiquidStack Featured Partners & Collaborators
Get in Touch for a Consultation
Ready to connect with us and discuss the immersion cooling system that will work best for you?